Senior technical and executive management of select technology companies will have the opportunity to observe the highly ...
Semiconductor packaging plays a crucial role in modern electronics by protecting the chip, enabling electrical connections, ...
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The World’s Smallest Microcontroller Could Reshape the Future of Wearable Tech and MedicineThe microcontroller’s tiny size is made possible by wafer-level chip-scale packaging (WLCSP), an advanced manufacturing ...
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Computer chip packaging and testing center comes to New Yorkshe signed the Green CHIPS legislation. Currently, the most advanced packaging takes place in Arizona and Texas. Landing a hub at the scale proposed by GlobalFoundries in Malta will drive ...
Under the MoU, RRP Electronics, which has expertise in assembling and testing semiconductor components, will integrate Deca’s Wafer-Level Chip Scale Packaging (WLCSP) and M-Series Fan-Out Wafer ...
The establishment of ASE’s new chip packaging and testing facility marks a significant milestone, introducing cutting-edge technological capabilities to its decades-long operations in the state.
Under this collaboration, RRP Electronics will integrate Deca’s Wafer-Level Chip Scale Packaging and M-Series Fan-Out Wafer-Level Packaging technologies into its processes. This will elevate the ...
Microsystems, a division of izmo Ltd. (NSE: IZMO) is proud to announce its role as the exclusive industry partner with IIT Madras in a groundbreaking project at the Centre for Programmable Photonic ...
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