Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible ...

There are currently three ways of Cu-Cu hybrid bonding (see the benchmarking table below). Wafer to Wafer (W2W) process is the most commonly used, whereas die-to-wafer (D2W) or chip to wafer (C2W) ...

SE: With all these thermal issues and growing complexity of these multi-die assemblies, are there new kinds of stress testing ...

Other leading makers of 3D NAND memory — including Kioxia/Sandisk and YMTC — also produce 3D NAND array and periphery on different wafers and then bond them together. Such an architecture ...

Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...

The EV Group (EVG), a provider of process solutions for semiconductor designs and chip integration schemes, has unveiled the next-generation version of its GEMINI automated production wafer bonding ...

It is the ideal tool for activating silicon surfaces prior to hybrid wafer bonding. The STW-10 accepts FOUPs containing 300 mm wafers or cassettes with dies on a tape frame. In terms of maximum ...

It uses what is known as a hybrid-bonding technique to join two wafers together. Following last year’s release of Xtacking4.0 devices such as YMTC’s 160-layer product, industry observers ...

The new test cell integrates Teradyne's UltraFLEXplus automated test equipment (ATE) and programming environment, IG-XL, with ficonTEC's advanced optical alignment, probing, and wafer handling ...

Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the new GEMINI equipment platform includes a newly designed high-force bond chamber that ensures excellent ...