One significant area of research is the development of 3D wafer-level packaging (WLP ... of strong bonds between thermally oxidized silicon wafers without the need for high temperatures, which ...

Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

GlobalFoundries (GF) has announced plans to build an Advanced Packaging and Photonics Center in the state of New York, USA.

Pure play semiconductor foundry GlobalFoundries (GF) said it will create a new center for advanced packaging and testing of U.S.-made essential chips at its New York manufacturing facility.

GlobalFoundries announces plans to create a new centre for advanced packaging and testing of US-made essential chips.

and the new chip-packaging-and-testing center will be used to test GlobalFoundries' photonics-based chips. After individual chips are cut from a 12-inch completed silicon wafer, they must have ...

US foundry GlobalFoundries Inc. has said it plans to create a center for advanced packaging and test of chips within its New ...

The center is designed to enable semiconductors to be securely manufactured, processed, packaged and tested entirely onshore ...

The funds will enable new technologies to be validated and transitioned at scale.

GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an additional $186 million investment in research and development over the next ...