We also use a multi-zone membrane carrier to locally apply different pressures across the wafer, instead of applying just one pressure.” Perhaps the most common TSV architecture today for silicon ...

Using live cells arrayed on a chip, a Stanford University team has prototyped an implantable silicon wafer designed not only to improve ... will be nearly 2.5 cm in diameter, 10 microns thick, and ...

Bhd., Malaysia's premier wafer foundry, today announced an agreement for Artisan to develop and deliver its library products for 1st Silicon's advanced 0.15-micron CMOS process. The agreement extends ...