Doping is the process of adding impurities to silicon wafers in a controlled manner to alter the electrical properties of the semiconductor. [Zach]’s doping method is a more localized version of ...
How much does it cost TSMC to start up its new chip-manufacturing plants on US soil? According to a new study by TechInsights ...
On March 22, the JFS Laboratory research team in Wuhan, Hubei province, announced the world’s first successful fabrication of 8-inch N-polar GaN-on-insulator (GaNOI) wafers on silicon substrate.
We are developing a new cell fabrication process using ion implantation. Our ion implantation technique ... conversion efficiency to exceed the Shockley-Queisser limit (29%) of silicon solar cells. We ...
RRP Electronics, a leading OSAT (Outsourced Semiconductor Assembly and Test) player in India, plans to buy a silicon wafer line, along with process and technology know-how transfer from PTW ...
Topics include: silicon structure, wafer preparation, sequential techniques in micro ... Metallization for conductors, Ion implantation for depletion mode and CMOS transistors for better yield speed, ...
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