One implementation of the two materials in RF power amplifiers is as a stack, known as GaN-on-SiC, which was intended to give ...

Breakthrough approach delivers better scaling and power efficiency, but at the cost of new processes like wafer thinning, ...

The company plans expansion in the US, with two advanced packaging facilities to be constructed near its Arizona chip fabs.

Consumers to Have Better User Experience and Longer Battery Life in Portable Devices, More Applications ... the number of chips produced on each silicon wafer, increase processing performance and ...

A research team from the Ningbo Institute of Materials Technology and Engineering (NIMTE) of the Chinese Academy of Sciences ...

The tandem device is based on a bottom thin-film heterojunction cell that can bend and a top perovskite cell that can be ...