At its North American Technology Symposium, it introduced its next-generation system-on-wafer platform—CoW-SoW—that will enable 3D integration with wafer-scale designs. This builds on the InFO ...

Atlant 3D has raised $15 million as demand grows for its manufacturing system that builds materials and devices atom by atom.

AM is gaining ground in the semiconductor industry, particularly in the production of tools like manifolds and wafer chucks.

The key processes—EIC/PIC 3D integration and fiber assembly—will be discussed in detail later. For the integration of EIC and PIC, chip-on-wafer 3D stacking is an effective method to minimize the ...