One of the most complex parts of this process is lithography: the step in which shapes are drawn onto a silicon wafer. There are several ways to do this, all of them rather complicated ...
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TSMC to go 3D with wafer-sized processors — CoW-SoW technology allows 3D stacking for the world's largest chipsTSMC is taking the wafer-scale fabrication battle into the third dimension with a new technology. At its North American Technology Symposium, it introduced its next-generation system-on-wafer ...
Chip giant TSMC is investing a historic $165 billion in U.S. semiconductor manufacturing, the company announced earlier this ...
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