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TSMC takes 'chip binning' to a whole new level as entire wafer 'found in a dumpster'Not wirecutter - a wire cutter, that is a machine with a thin wire that cuts wafer into chips and minimizes dust. After that, you need an assembly machine that will place your chips onto a ...
And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?
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