Intel's new roadmap; EU chip plan needs work; RISC-V boost; UK IC workforce study; materials and wafer shipments; on-chip PDN ...

Backside power delivery relocates power to the back of the wafer and leaves only signals to be transmitted through frontside interconnects. At a fundamental level ... in the lithography after all the ...

The Photomask Solutions segment also develops and sells solutions for the cleaning of high-precision and contamination-sensitive photomasks used in semiconductor lithography processes. The ...

KLA continued share leadership was highlighted by persistently strong customer adoption of optical patterned wafer inspection and share gain in advanced wafer level packaging. Over the past five ...

The 2024 Annual Collective Performance Briefing for the Sci-Tech Innovation Board's Semiconductor Equipment Industry was held on the afternoon of April 28, with seven publicly listed firms including ...

Atum Works claims its nanoscale 3D printing technology can cut chip production costs by 90% by replacing traditional ...

Veeco Instruments Inc. (NASDAQ: VECO) announced today two leading-edge logic customers have selected Veeco’s Laser Spike Annealing Platform as Production Tool of Record for new applications at their ...

This focus on panel-level techniques complements TSMC’s existing, highly sought-after advanced packaging methods like CoWoS (Chip-on-Wafer-on-Substrate). CoWoS, which allows for the dense ...