Aston Martin say they are “committed” to their current driver lineup but did not rule out a reported $300 million move for Max Verstappen. The Dutchman has often been linked with a move to the ...

Smartphone chipsets have reached a point where even the so-called “sub-flagship” SoCs pack more power than most users need in their day-to-day usage. But when comparing something like MediaTek ...

Central State University's Marauder football team just scored a new teammate of its own off the field, bringing Pat Clark on board as the Associate Head Coach and Co-Defensive Coordinator.

As for the Dimensity 9500 itself, it’s still expected to be fabbed on TSMC’s 3nm N3E node. The chip will reportedly feature two Cortex-X930 “Travis” cores and six Cortex-A730 “Gelas ...

The 1.8V Fault-Tolerant General Purpose I/O library provides a 3.3V tolerant programmable, bidirectional I/O that give the system designer the flexibility to design to a wide range of performance ...

The latest DDR4 SDRAM memory standard offers significant performance benefits for SoC designers. Graham Allan, senior product marketing manager for DDR at Synopsys, discusses some of the challenges ...

Cash-strapped Brits can give their bank a hefty boost worth up to £186 with one simple move. Millions of households will now be feeling the full wrath of 'Awful April' following a series of ...

Through this acquisition, Saronic gains a strategically located shipyard on the Gulf Coast that will serve as the prototyping and production hub for its medium unmanned surface vessel (MUSV) fleet — ...

The nearly 100-acre Gulf Craft facility will serve as the prototyping and production hub for Saronic’s medium uncrewed surface vessel (MUSV) fleet, starting with the 150' autonomous surface vessel ...

Martin Lewis has clarfied a National Savings and Investments question he is "often" asked by followers. The 52-year-old Money Saving Expert issued his verdict on NS&I Premium Bonds on his BBC ...

Dimensity 9400 Plus is built on TSMC’s N3E enm process Dimensity 9400 Plus is built on TSMC’s second-generation 3nm process, N3E, and it is up to 40% more power-efficient than its predecessor ...