Nvidia (NASDAQ: NVDA) has secured over 70% of Taiwan Semiconductor Manufacturing Co.s (NYSE: TSM) advanced chip packaging ...

Intel says its cutting-edge 18A process node is 'now ready' and that tape-out begins in 1H 2025, ready to compete with ...

The European Commission (EC) has approved a €920 million ($964m) funding package to support the construction of Infineon’s new chip fab in Dresden, Germany.

Akara extends decades of Lam leadership in conductor etch. This includes multiple generations of the company's highly ...

The convergence of front-end and back-end processes in advanced packaging is reshaping the industry. The semiconductor ...

Within the next several weeks, Intel is likely to be broken up into at least two, possibly even three or more pieces, as the world’s largest chip-making firm or foundry operator, Taiwan Semiconductor ...

Advanced packaging technologies and high-bandwidth memory (HBM) have fueled a surge in global chip demand. Beneath the ...

"Artificial intelligence is probably the biggest fundamental technology revolution of our lifetimes," Archer said ...

Lam Research chief executive said the thirst for complex, artificial intelligence silicon will push the likes of TSMC to purchase larger numbers of the ...

Korean firms accelerate glass substrate development to challenge Nvidia, TSMC Domestic tech giants ramp up glass substrate ...

The US wants to bring back domestic chipmaking. But America’s first generation of Silicon Valley factory workers endured ...

Lam Research executives gave a company update to investors on Wednesday and shares jumped as much as 3% during the roughly ...