And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

Focusses on Advanced IC-Substrates and Next Generation Wafer-Level Packaging ...

The NXP EdgeLock A30, smaller than a grain of rice, protects digital data from tampering, aiding future EU digital product passport requirements.

GlobalFoundries (Nasdaq: GFS) (GF) today announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility.

Aug. 25, 2020 -- Synopsys, Inc. (Nasdaq: SNPS) today announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging ... based Chip-on-Wafer-on-Substrate ...