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Hyperlume is actively collaborating with tier-one AI chip manufacturers, advanced packaging foundries, and fiber optics ...
Intel, a US chip manufacturer, then said it would invest $1.2bn in Costa Rica over two years. Mexico and Brazil, the region’s ...
TSMC’s A14 process boosts computing power, improves energy efficiency and transforms global manufacturing in a rapidly ...
Today's high-end processors, especially those powering data centers and AI workloads, already rely on multi-chiplet designs ...
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Tom's Hardware on MSNStartup aims to 3D print chips and cut production costs by 90% — nanoprinter operates at wafer scaleAtum Works claims its nanoscale 3D printing technology can cut chip production costs by 90% by replacing traditional ...
TSMC Unveils A14 Process and System on Wafer-X: A Leap Forward for AI and High-Performance Computing
Taiwan Semiconductor Manufacturing Company (TSMC), the world’s leading semiconductor foundry, has announced a groundbreaking ...
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Tom's Hardware on MSNTSMC mulls massive 1000W-class multi-chiplet processors with 40X the performance of standard modelsTSMC is prepping a 9.5-reticle, 7,885 mm² multi-chiplet packages on 120×150 mm substrates with integrated power management ...
The company plans expansion in the US, with two advanced packaging facilities to be constructed near its Arizona chip fabs.
Analyst downgrades and U.S.-China export restrictions have spooked investors, dragging down multiple chip equipment makers. UBS, BofA, and Oppenheimer all trimmed Lam’s price targets, citing slowing ...
Amkor Technology, Inc. is an outsourced semiconductor packaging and test services provider. The company provides flip-chip scale package products, flip-chip stacked chip scale packages ...
Amkor Technology, Inc. is an outsourced semiconductor packaging and test services provider. The company provides flip-chip scale package products, flip-chip stacked chip scale packages ...
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