Disco Corporation (DSCSY, TSE:6146) develops, manufactures, and sells precision machines and precision processing tools for ...

glass wafer dicing products; laser glass marking; microscope slide and covers laser cutting systems; precision glass scribers; semiconductor laser systems; OEM laser marking and engraving parts ...

Semiconductor-grade silicon for research Undoped Silicon Wafers for university researchers BOSTON, MA, UNITED STATES, April 16, 2025 /E ...

The points of the target shape on the right form a circular inner ring, as shown by the blue tracing. If you draw that exact ...

Publication citation: C. -H. Lai, W. -J. Yin, W. -H. Lai, C. -L. Kao, C. -C. Wang and C. Hung, “Fine-Line RDL Structure ...

Intel has taken an early lead in High-NA EUV lithography, but widespread adoption remains constrained by high tool costs, ...

Pre-series wafers have already been completed. AMD is giving an unusually early preview of its next generation of processors for servers (codenamed Venice aka Epyc 9006). At least some offshoots ...

"When each is on their game, they are more than capable of dicing up opposing secondaries and have enough arm strength to push the ball downfield. Smith was a victim of circumstance early in his ...

Inspired by centuries-old samurai sword forging techniques, these knives aren't just kitchen tools, they're game-changers that redefine what precision cutting means. Imagine effortlessly slicing ...