NexWafe is one of a few companies looking to build US wafer capacity. Image: NexWafe. The US government has clarified specific domestic content measures to support US silicon wafer manufacturers ...

Key Laboratory for Micro-Nano Optoelectronic Devices of Ministry of Education, School of Physics and Electronics, Hunan University, Changsha 410082, China ...

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates which ...

Department of Electrical Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan Institute of Electronics Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan Center for ...