Nexperia’s new X.PAK packaging combines high thermal performance, compact size, and easy assembly for high-power applications ...

SEICA, a global leader in supplying high-technology, innovative test solutions to the electronics industry, is pleased to ...

The portfolio of 1200V SiCPAK power modules, enabled by advanced epoxy-resin potting technology, are engineered to withstand ...

Navitas Semiconductor (NVTS) announces the release of its latest SiCPAK power modules with epoxy-resin potting technology, powered by ...

Navitas Semiconductor (Nasdaq: NVTS), the only pure-play, next-generation power semiconductor company and industry leader in ...

Mitsubishi Electric Corporation will begin shipping samples of two new SLIMDIP series power semiconductor modules for room ...

SemiQ Inc, a designer, developer, and global supplier of superior silicon carbide (SiC) solutions for ultra-efficient, ...

Toshiba Electronics Europe is introducing a number of solutions to enable engineers to meet their system efficiency and ...

Mitsubishi Electric has unveiled full and hybrid SiC SLIMDIP samples. Takeaway Points Mitsubishi Electric will start shipping samples of two new SLIMDIP series power semiconductor modules 22. From May ...

Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will begin shipping samples of two new SLIMDIP series power semiconductor modules for room air conditioners and other home ...

BASiC Semiconductor’s SiC MOSFET modules redefine performance benchmarks for industrial and commercial energy storage PCS. With unmatched efficiency, thermal resilience, and system-level cost savings, ...

ROHM has developed N-channel power MOSFETs featuring industry-leading* low ON-resistance and wide SOA capability. They are designed for power supplies inside high-performance enterprise and AI servers ...