At its North American Technology Symposium, it introduced its next-generation system-on-wafer platform—CoW-SoW—that will enable 3D integration with wafer-scale designs. This builds on the InFO ...

Lam Research benefits from the rise in AI-driven chip demand. Read why LRCX stock is a solid buy for long-term investors ...

AI can help with workload distributions when considering on-device versus cloud processing. The latter has a very large ...

Atlant 3D has raised $15 million as demand grows for its manufacturing system that builds materials and devices atom by atom.

Intel's semiconductor manufacturing strategy has undergone drastic changes over the past few years, reflecting both ...

The key processes—EIC/PIC 3D integration and fiber assembly—will be discussed in detail later. For the integration of EIC and PIC, chip-on-wafer 3D stacking is an effective method to minimize the ...

and its Direct Wafer process enables the production of thinner 3D wafers by reducing the amount of silicon used to less than 1.5 g/W without compromising quality. The company said its production ...