And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

Senior technical and executive management of select technology companies will have the opportunity to observe the highly anticipated POET Blazar prototype in private meetings with POET management.

The combined thickness of an HBM module with 12 DRAM dies and a base logic chip ... Wafer thinning, temporary bonding, thin wafer processing, and debonding methods are becoming essential process steps ...

wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer ...

Amkor Technology, Inc.’s AMKR share price has dipped by 14.95%, which has investors questioning if this is right time to buy.

At 5pm yesterday, the equipment manufacturer of wafer level chip scale packaging sorting machines for the semiconductor industry saw its shares hit a new high to close 17 sen up at RM3.32.