AU Optronics (AUO) has collaborated with Sony Honda Mobility to unveil an innovative Micro LED Display Human-Machine ...

The company has plans to demo its next-gen 16-layer HBM3E prototype alongside a high-capacity enterprise SSD, and new ...

Today, Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) ...

An analyst has warned that AMD may lack a competitive edge in AI chips, despite earlier market expectations of challenging ...

Samsung Electronics expects lower operating profit due to R&D costs and weak demand for memory chips. Nvidia approves Samsung ...

Micron Technology, Inc. (NASDAQ: MU) broke ground on a new HBM advanced packaging facility in Singapore, expanding its capacity and creating jobs.

Samsung Electronics is taking heat after posting a weak ₩6.5 trillion ($4.5 billion) operating profit for Q4 2024.

Nvidia CEO Jensen Huang publicly addressed challenges regarding Samsung Electronics' HBM3E memory design, marking his first ...

LAS VEGAS - Samsung Electronics CEO and Vice Chairman Han Jong-hee said, Tuesday (local time), that the company's artificial ...

Nvidia CEO says Samsung needs to redesign HBM, but expresses confidence in firm's success Samsung Electronics on Wednesday ...